Teardown shows drastic measures taken by Sony to curb overheating on the Xperia Z5 series
The #Sony #XperiaZ5 lineup was revealed by the company a couple of days ago. Much to our surprise, the company stuck with the #Qualcomm #Snapdragon810 SoC, despite seeing other manufacturers getting some flak for using the chip. And it seems like the company didn’t take this decision in haste and has ensured that no overheating will occur on either of the three smartphones that were announced.
To make sure that the heating is kept to a minimum, the company has used dual thermal pipes on the handset which will divide the heat twice as much as before. To put things in perspective, the company used a single heat dissipation pipe in last year’s Xperia Z3 flagship (image below), so it’s clear that this was one of the main concerns for the company.
The Japanese manufacturer has been struggling in the high end smartphone market and will hope that the new range of the Xperia Z5 flagships will turn the tide in their favor. The Xperia Z5 Premium will be marketed heavily by Sony for being the world’s first handset to pack a 4K display, while the Xperia Z5 and the Xperia Z5 Compact will have decent exposure in the markets as well.
Via: Xperia Blog
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